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Qualcomm Off Campus Drive 2023 drive is scheduled for freshers across India. So if you are interested for the same kindly apply as soon as possible.
| Company Name | Qualcomm |
| Name of Post | DSP Firmware Engineer |
| No Of Post | Not Mentioned |
| Who Can Apply ? | BE/B.Tech |
| Which Batch Students Eligible | 2022/2023 Batch |
| Job Location | Hyderabad |
| Salary | Rs 4.5 LPA – Rs 12 LPA ( Depends on Interview ) |
| Application Mode | Online |
| Last Date To Apply | Not Mentioned |
| Official Website | www.qualcomm.com |
Job Description
- Candidates are primarily responsible for the implementation of communication algorithms in assembly language on DSP. You will also work closely with Communication System Engineers and Modem ASIC Designers to implement, optimize and influence the current and long term design of our modems.
- Minimum Qualifications Strong background in communication theory and digital signal processing (DSP) -Strong assembly and embedded C programming skill on DSP platform -Strong understanding on real-time embedded system -Experience in working on RTOS -Ability to work well in a team environment working on multiple projects with challenging deadlines.
Job Requirements
- 1+ years of experience with Development Environment Software such as Apache Maven, Ruby, etc.
- 1+ years of experience with Database Management Software.
- 1+ years of experience working in a large matrixed organization.
- 1+ years of experience with Testing Software such as Bugzilla, LoadRunner, etc.
How to Apply for Qualcomm Off Campus Drive 2023?
All interested and eligible candidates can apply for Qualcomm Off Campus Drive 2023 drive by the following link latest by as soon as possible.